Experiment System
NO TEST ITEM TEST CONDITION DURATION REFERENCE DOCUMENT
1 SOLDER ABILITY 230° ±5°C 5 SEC MIL-STD-202   METHOD 208
2 LEAD PULL 2KG IN AXIAL LEAD DIRECTION 10 SEC MIL-STD-750 METHOD-2036
3 LEAD FATIGUE 90-DEGREE BEND WITH 0.5KG WEIGHT ATTACHED TO LEAD 3 TIMES MIL-STD-750 METHOD-2036
4 OPERATING LIFE RATED CURRENT @25°C 168/1000 HRS MIL-STD-750C  METHOD 1027
RATED VOLTAGE
5 HIGH TEMPERATURE REVERSE BIAS 80% RATED VOLTAGE 125°C FOR STD TYPE 168/1000 HRS MIL-STD-750   METHOD 1038
  150°C FOR GPP TYPE
6 INTERMITTNET OPERATING LIFE ON:5MIN WITH RATED IRMS POWER 1000 CYCLES MIL-STD-750 METHOD-1036
OFF:5MIN WITH COOL FORCED AIR
7 FORWARD SURGE CURRENT 8.3ms SINGLE HALF SINE-WAVE SUPERIMPOSED ON RATED LOAD 1 PULSE MIL-STD-750   METHOD 4066
8 HIGH TEMPERATURE STORAGE LIFE TSTG(max) 168/1000 HRS MIL-STD-750   METHOD 1031
9 LOW TEMPERATURE STORAGE LIFE TSTG(min) 168/1000 HRS IEC-68-2-1        TEST A COLD
10 MOISTURE RESISTANCE 85°C,85%RELATIVE HUMIDITY 168/1000 HRS MIL-STD-750   METHOD 1021
11 PRESSURE COOKER 15PSIG,121°C 4 HRS MIL-S-19500  APPENDIX C
12 THERMAL SHOCK 0°C/5 MIN,100°C/5 MIN 10 CYCLES MIL-STD-750   METHOD 1056
13 TEMPERATURE CYCLING TSTG(max)/15 MIN TSTG(min)/15 MIN 25°C/5 MIN FOR TRANSFER 10 CYCLES MIL-STD-750   METHOD 1051
14 SOLDERING HEAT 260°C+5°C-0°C 10SEC MIL-STD-750   METHOD 2031